Contract Wafer Processing Services: Your Material or Ours
Send us your own LiNbO3, LiTaO3, quartz or other crystal material, and we'll slice, lap, polish, clean and inspect it to your spec — up to 8" in diameter. Prefer to source the crystal from us instead? We supply the raw material and process it end-to-end, so no crystal growth capability of your own is required.
How Our Wafer Processing Service Works: From Raw Crystal to Finished Wafer
A straightforward path from raw crystal material to finished, inspected wafers — whether it's your boule or ours.
Send Your Material or Spec
Ship us your crystal boule or wafers, or send your target material, diameter, thickness, cut orientation and grade. Our engineers evaluate the process route and get back to you with a quote and estimated lead time based on what you actually need.
We Process In-House
Slicing, chamfering, lapping and CMP polishing all run on our own line in Zhuji, with no subcontracted steps in between — so processing progress and quality stay fully under our control from start to finish. See the full manufacturing process.
Inspection & Cleanroom Delivery
Every batch is checked on dimensional, surface and electrical parameters, then cleanroom-packaged before it ships back to you, protected from contamination or damage in transit.
Wafer Processing Services: Slicing, Lapping, Polishing, Cleaning & Inspection
You can send us a single processing step or the full sequence, on LiNbO3, LiTaO3, quartz or other piezoelectric and optical crystal materials. Every step below runs on our own equipment in Zhuji, so your material stays under one roof from the moment it arrives to the moment it ships back to you.
These eight steps are interdependent — slicing precision determines how much material lapping and polishing need to remove, and lapping uniformity determines how consistent the surface is after polishing. A deviation at any single step carries through to the next, and eventually shows up in the yield of the finished wafer. Keeping every step on one line, under one team, means we can trace a wafer's complete processing history from slicing to packaging — if something goes off-spec, we can pinpoint the cause and adjust immediately, instead of discovering a defect in the finished product and working backward through multiple subcontractors to find out where it happened.
Wire Saw Slicing
Diamond wire saw slicing cuts the crystal boule to a precise orientation and thickness. Slicing parameters set the wafer's initial thickness tolerance, warp and subsurface damage depth — the single step with the biggest impact on final yield; insufficient precision here is difficult to fully correct in later lapping and polishing.
Chamfering
Wafer edges are chamfered on precision grinding wheels, rounding the sharp edge left by slicing into a smooth curve. An unchamfered edge is highly prone to chipping during later lapping, polishing and handling — chamfering significantly cuts the rate of this type of edge defect.
Double-Side Lapping
Double-side lapping machines process both wafer faces simultaneously, removing the subsurface damage layer left by slicing while correcting thickness uniformity (TTV) and flatness (warp) to target range — establishing a consistent baseline for the polishing step that follows.
CMP Polishing
Chemical mechanical polishing combines chemical etching with mechanical abrasion to bring surface roughness down to the nanometer level, achieving final SAW-grade or optical-grade surface quality — the step that determines whether a wafer is suitable for high-end optical or RF device applications.
Precision Thinning
For requirements outside standard lapping tolerance, we run an additional thinning pass after double-side lapping to hold thickness within a tighter tolerance band, meeting custom requirements for ultra-thin wafers or specialized device designs.
Single-Wafer & Batch Cleaning
A combination of chemical and ultrasonic cleaning removes particles, polishing slurry residue and organic contamination left from lapping and polishing, providing a clean surface for downstream inspection — available as single-wafer precision cleaning or batch cleaning.
Full-Spec Inspection
Every batch is checked against dimensional, surface and electrical parameters using dedicated metrology equipment, wafer by wafer, with traceable inspection data — confirming that every wafer we ship meets the agreed specification.
Cleanroom Packaging
Wafers that pass inspection are graded, vacuum-sealed and packaged under cleanroom conditions to prevent secondary contamination or damage from dust, moisture or static during transit and storage — so what arrives matches what left our inspection line.
Who Uses Our Wafer Processing Services
Contract wafer processing fits a different customer than our standard product catalog — typically someone who already has crystal material, or a very specific spec, and needs a partner who can take on a single step or the full sequence, rather than picking the closest match from an off-the-shelf catalog. Here are the four types of customers we work with most.
Crystal Growers Without a Processing Line
Companies that grow their own LiNbO3, LiTaO3 or other crystal boules but don't have in-house slicing, lapping or polishing capability — we handle the downstream steps so you can sell finished wafers instead of lower-margin raw boules to a downstream processor.
SAW Filter & RF Component Manufacturers
Device makers who need wafers cut to a specific cut angle, thickness or diameter that falls outside a standard catalog listing — we process to your exact spec rather than the nearest off-the-shelf size, so you're not compromising device performance to fit an available wafer.
R&D Labs & Research Institutions
Universities and research teams that need small-batch, custom-spec wafers for prototyping and testing, without committing to a full production order or burning budget just to hit a minimum order quantity.
Wafer Traders & Material Distributors
Companies that source raw crystal material and need a reliable contract processing partner to turn it into finished, inspected wafers ready for resale — without the capital investment of building their own line, while keeping quality consistent for their downstream customers.
Have Your Own Crystal Material? Let's Process It.
Tell us your material type, target grade, diameter and thickness — whether it's a single step or the full sequence, we'll get back with a clear processing quote and lead time.